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| Push Switch Horizontal Type Double Action SPEE Series Low-profile 0.7mm-travel type push switch. Detector Push Slide Rotary Encoders Power Typical Specifications Items Rating max. min. Resistive load Travel Operating force Operating life Specifications 20mA 5V DC/100BA 3V DC 1st 0.3mm 1st 1.75N 2nd 0.71mm 2nd 1.1N 100,000cycles Product Line Dual-in-line Package Type TACT SwitchTM CustomProducts Poles 1 Positions 2 Terminal type For PC board (Reflow) Minimum order unit pcs. 14,000 Product No. SPEE120103 Taping Specifications (Taping Packaging) Reel Size Unit:mm Number of packages pcs. 1 reel 1 case /Japan 1 case /export packing Tape width mm Horizontal Type Vertical Type 380 17.5 3,500 7,000 14,000 16 Dimensions Style 1.4 0.9 0.95 0.15 Unit:mm PC board mounting hole dimensions Viewed from direction A 4.6 2 C 4.7 A F (5) (3.5) 3.15 x 3.98 4.31 0.32 x 1.22 2 3.3 3.6 5 1.15 x C B x F terminals are solderling terminals for switch fixing only. Do not conect with other circuits. Out Put Chart A Initial position First position Second position Full travel B Circuit Diagram (Viewed from Direction A) Internal circuit A C B Notes 1. Products other than those listed in the above chart are also available. Please contact us for details . 2. Please place purchase orders per minimum order unit (integer). 84 0.45 2.05 0.5 A F 0.95 3.5 Push Switches List of Varieties Series SPEE SPPJ6 SPPJ3 SPPJ2 SPUJ SPUP SPUN SPUN SPEG SPPH2 Detector Push Slide Rotary Encoders Power Dual-in-line Package Type TACT SwitchTM CustomProducts Photo Travel mm Total travel mm Number of poles W Dimensions mm D H Operating temperature range 0.3 0.71 0.9 1 4 1.5 2.5 2 1 2 6.6 9 2.5 3.5 2 7.2 12 2 3 1.5 2 2.5 3 2 4 7.5 15.2 22.7 2.5 3.5 1.2 1 10 24 36 7.15 8.35 3.5 60C 1 1.5 2 6.5 6 6.5 5 1.22 10C to 4.5 60C 8.3 9.6 85C 8.8 10.3 13 10C to 40C to Rating max. Resistive load 20mA 5V DC 0.2mA 5V DC Rating min. Resistive load Electrical performance Mechanical performance Durability Environmental performance Soldering 100BA 3V DC 0.2mA 30V DC 50BA 3V DC 20m 100M 0.1mA 30V DC 1A 25V DC 50mA 16V DC 0.1A 12V DC 50BA 3V DC Initial contact 2 resistance Insulation 10M resistance 100V DC 100V AC Voltage for 1minute proof Terminal strength Operating direction Pulling direction 100,000 cycles 100,000 cycles -40 2 for 96h 50N 30N max. 200m max. 30m max. min. 500V DC 500V AC for 1minute 5N for 1minute 3M min. 100M min. 100V DC 500V DC 100V AC for 500V AC for 1minute 1minute 0.5N for 1minute 50N 50N 5N for 1minute 30N Horizontal Type Vertical Type Actuator strength Operating life without load Operating life without load Load:as rating Cold Dry heat Damp heat Manual soldering Dip soldering Reflow soldering Page 10,000cycles 40m max. max. for 96h for 96h 10,000cycles 40m -20 85 40 2 2 2 30,000cycles 10,000cycles 40m max. 40m max. 35,000cycles 10,000cycles 5,000cycles 500m max. 50m max. 40m max. -20 85 2 2 for 96h for 96h , 90 to 95%RH for 96h 300 10 1 3 0s 350 10 3 1s 0 260 10 5 1s 40 2 , 90 to 95%RH for 96h 350 5 3s max. 350 max. 3s max. 260 5 5 1s Please see P.108 350 10 1 4 0s 350 10 1 3 0s 260 5 5 1s 260 5 10 1s 260 5 5 1s Please see P.108 84 85 86 88 90 91 92 94 96 Notes 1. F 1. The operating temperature range for automotive applications can be raised upon request. Please contact us for requirements of this kind. 2. F 2. 1V or less, at the present rating of 1mA, 5V DC for output voltage. 82 Push Switches Soldering Conditions Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 Detector Push Slide Rotary Encoders Power Dual-in-line Package Type TACT SwitchTM CustomProducts Series Reflow type SPEE 260 230 40 180 150 120 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile 300 Temperature (C ) A max. B 200 D E 100 Time (s) Pre-heating F max. C Room temperature A 3s max. B Cs D E Fs SPEF, SPEG Notes Horizontal Type Vertical Type 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. 108 |
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